Recommendations for soldering
This information helps to optimize the soldering process
This recommendation applies to the following E-T-A products:
Reflow soldering
The above-mentioned products are not suitable for reflow soldering.
Wave soldering for processing in soldering masks (lead-free)
Wave soldering for processing in soldering masks (lead-free)
Temperature difference between soldering bath and preheating: < 120 °C
Temperature on top of printed circuit board: 120 °C
Temperature on bottom of printed circuit board: 140 °C
Pot temperature (depending on alloy used): 260 °C – 280 °C
Contact time:
- 3-hole nozzle: 2 s – 3 s
- 5-hole nozzle: 4 s – 6 s
- 1-2 waves (chip and Wörthmann wave): max. 10 s
Selective soldering for processing in soldering masks (lead-free)
Temperature difference between soldering bath and preheating: < 120 °C
Temperature on top of printed circuit board: 120 °C
Temperature on bottom of printed circuit board: 140 °C
Pot temperature (depending on alloy used): 280 °C – 300 °C
Contact time:
- 3-hole nozzle: 2 s – 3 s
- 5-hole nozzle: 4 s – 6 s
- 1-2 waves: max. 10 s
Hand soldering / soldering iron (lead-free)ei)
Output of soldering stations (controlled electronically): 80 W – 100 W
Soldering temperature: 300 °C – 350 °C
Contact time: 3 s – 6 s
Solderability of silver-plated
Solderability of silver-plated terminals is limited in time. We ensure proper solderability up to six months after delivery date.
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